Kupanga Kwazithunzi za LED: Njira, Miyezo, ndi Kuwongolera Kwabwino

Kuyamba kwa LED Display Technology

ZamakonoMawonekedwe a LEDkudalira semiconductor electroluminescence, kumene InGaN/GaN tchipisi timatulutsa kuwala buluu (450nm) osandulika woyera kudzera phosphor zokutira. Zowonetsa zapamwamba zimafikira 16-bit grayscale, mitengo yotsitsimutsa ya 3840Hz, ndi kuwala kwa 5,000 nits pamapulogalamu akunja.

Zida Zopangira ndi Zigawo

1. Chips za LED

• Mtundu: InGaN buluu chips (2835/1010 phukusi)

• Zofotokozera:

• Kutalika: 450±2nm

• Forward Voltage: 2.8-3.4V @20mA

• Mphamvu Yowala: ≥180 lm/W

2. Zipangizo Zam'kati

3. Magawo

• Aluminium PCB: Thermal conductivity ≥2.2W/m·K, Cu makulidwe 35±5μm

• Ceramic PCB: Magawo a AlN (24W/m·K) a magulu amphamvu kwambiri a LED

LAMP LED Production Workflow

1. Die Bonding

• Zomatira: Silver epoxy (80% Ag zili)

• Kuchiritsa: 150 ℃/1hr, chomangira mzere makulidwe 25±5μm

• Kulondola: Vuto loyika ≤±15μm

2. Kulumikiza Waya

• Waya: 99.99% Au, awiri 1.0mil

• Parameters: Akupanga mphamvu 50W, mphamvu 30g, nthawi yozungulira 0.3s

3. Kufotokozera

• Njira: Vacuum potting (≤1kPa, 30min degassing)

• Kuchiritsa: 135 ℃/4hrs, kuwira awiri ≤30μm

4. Msonkhano Womaliza

• Kupanga Pin: Kumeta ubweya wa ubweya ± 0.1mm kulolerana

• Binning: Wavelength ± 2nm, kuwala kowala ± 5%

SMD LED Manufacturing Njira

1. Solder Matani Kusindikiza

• Stencil: Laser-kudula zosapanga dzimbiri chitsulo, 0.12mm makulidwe

• SolderSAC305 aloyi, voliyumu 80-120μm (SPI kuyang'aniridwa)

2. Chigawo Kuyika

• MakinaKusankha ndi malo othamanga kwambiri (30,000 CPH)

• Kulondola± 0.03mm (X/Y), ±0.5° (θ)

3. Reflow Soldering

• Mbiri:

• Preheat: 1-2 ℃ / s mpaka 150 ℃

• Pamwamba: 245 ℃ (60s pamwamba 217 ℃)

• AtmosphereNayitrogeni (O₂ <1,000ppm)

4. Kuumba ndi Dicing

• Kuumba: Njira yosinthira @8-12MPa, 150 ℃/180s

• Kudula kwa Laser: 355nm UV laser, 5W mphamvu, 100mm / s liwiro

Mini/Micro LED Advanced Processes

1. Technology Transfer Technology

• Laser Lift-Off (LLO):

• Kusamutsa: 99.99% (R&D), 99.9% (kupanga)

• Kulondola: ± 1.5μm kuyika

2. Chip-on-Board (COB)

• Pixel Density100-200 PPI

• EncapsulationKudzaza kwa epoxy wakuda (ΔE <1.5)

3. Miyezo ya Galimoto ya Magalimoto

• AEC-Q102: -40 ℃ kuti 125 ℃ ntchito, 85 ℃/85% RH/1,000h

• Mayeso a Vibration: Kugwedeza kwa 50G (MIL-STD-883 Njira 2002)

Quality Control Systems

1. In-Process Kuyendera

• AOI: Kuzindikira zolakwika ≥99.9% (milatho yogulitsira, magawo akusowa)

• X-ray: Kutayika kwa <15% m'magulu a solder

2. Kuyesa Kwachilengedwe

3. Kuyesa kwa Photometric

• Kuphatikiza SphereKulekerera kwa CCT ± 150K, CRI ≥80

• Kuwona angle: ≥140 ° yopingasa / ofukula, ≤50% kuwala kutsika

Kupaka ndi Logistics

1. Chitetezo cha Chinyezi

• Mtengo wa MSLLevel 3 (72hrs floor life @30℃/60%RH)

• Dry Packaging: <10% RH yokhala ndi desiccant

2. Kukantha Kugwedezeka / Kugwedezeka

• Mtengo wa 3A: Imapulumuka madontho a 1.2m, zotsatira za 50G

3. Zolemba Zogwirizana

• Chitetezo: UL/CUL, CE, CCC

• ZachilengedweRoHS 2.0, FIKIRANI SVHC <0.1%