Okukola LED Display Screen: Enkola, Omutindo, n'Okulondoola Omutindo

Enyanjula mu Tekinologiya wa LED Display

MunnakuzinoScreens eziraga LEDbeesigamye ku semiconductor electroluminescence, nga InGaN/GaN chips zifulumya ekitangaala kya bbululu (450nm) ekikyusiddwa okufuuka enjeru nga kiyita mu phosphor coating. Displays ez’omulembe zituuka ku 16-bit grayscale, 3840Hz refresh rates, n’okumasamasa kwa nits 5,000 okukozesebwa ebweru.

Ebintu Ebisookerwako n’Ebitundu Ebikozesebwa

1. Chips za LED

• Okuwandiika: Ebikuta bya bbululu ebya InGaN (ebipapula 2835/1010)

• Ebikwata ku nsonga eno:

• Obuwanvu bw’amayengo: 450±2nm

• Voltage y’omu maaso: 2.8-3.4V @20mA

• Obulung’amu bw’ekitangaala: ≥180 lm/W

2. Ebikozesebwa mu Encapsulation

3. Ebintu ebiyitibwa substrates

• PCB ya Aluminiyamu: Obutambuzi bw’ebbugumu ≥2.2W/m·K, Obugumu bwa Cu 35±5μm

• PCB eya keramiki: AlN substrates (24W/m·K) ku nsengekera za LED ez’amaanyi amangi

Enkola y'okukola emirimu gya LAMP LED

1. Okufa Okukwatagana (Die Bonding).

• Ekyesiiga: Epoxy ya ffeeza (80% Ag erimu) .

• Okuwonya: 150°C/1hr, obuwanvu bwa layini y’okukwatagana 25±5μm

• Tuufu: Ensobi mu kuteeka ≤±15μm

2. Okusiba waya

• Waaya: 99.99% Au, obuwanvu bwa 1.0mil

• Ebipimo (parameters).: Amaanyi ga Ultrasonic 50W, amaanyi 30g, obudde bw’enzirukanya 0.3s

3. Okusiba ebizigo

• Omutendero: Okuteeka mu kiyungu mu vacuum (≤1kPa, okuggya omukka mu ddakiika 30)

• Okuwonya: 135°C/4hrs, obuwanvu bw’ekibumba ≤30μm

4. Olukiiko Olusembayo

• Okukola Pin: Okusala okusala ±0.1mm okugumiikiriza

• Okuteeka ebibbo: Obuwanvu bw’amayengo ±2nm, amaanyi g’ekitangaala ±5%

Enkola y'okukola SMD LED

1. Okukuba ebitabo mu Solder Paste

• Ekiwandiiko ekiyitibwa Stencil: Ekyuma ekitali kizimbulukuse ekisaliddwa layisi, obuwanvu bwa mm 0.12

• Solder (Solder) nga: SAC305 aloy, obuzito 80-120μm (SPI erondooleddwa)

2. Okuteeka Ebitundu

• Masiini: Okulonda n'okuteeka ku sipiidi ey'amaanyi (30,000 CPH) .

• Obutuufu: ±0.03mm (X/Y), ± 0.5° (θ) .

3. Okuddamu okufulumya Soldering

• Ebikukwatako:

• Okubugumya: 1-2°C/s okutuuka ku 150°C

• Entikko: 245°C (60s waggulu wa 217°C)

• Embeera y’empewo: Nayitrojeni (O2 <1,000ppm) .

4. Okubumba n’okukola Dicing

• Okubumba: Enkola y'okukyusa @8-12MPa, 150°C/180s

• Okusala mu Layisi: Layisi ya UV eya 355nm, amaanyi ga 5W, sipiidi ya mm/s 100

Mini/Micro LED Enkola ez’omulembe

1. Tekinologiya w’okutambuza abantu abangi

• Okusitula-Okuggyako Layisi (LLO) .:

• Omuwendo gw’abakyusa: 99.99% (R&D), 99.9% (okufulumya)

• Obutuufu: ±1.5μm okuteeka

2. Ekintu ekiyitibwa Chip-on-Board (COB) .

• Densite ya Pixel: Ebitundu 100-200 PPI

• Okusiba ebizigo: Okujjuza epoxy omuddugavu (ΔE <1.5) .

3. Omutindo gw’Ekibiina ky’Emmotoka

• AEC-Q102: -40°C okutuuka ku 125°C okukola, 85°C/85%RH/1,000h

• Okugezesa okukankana: Okusannyalala kwa 50G (MIL-STD-883 Enkola 2002)

Enkola z’okulondoola omutindo

1. Okukebera mu nkola

• AOI: Okuzuula obulema ≥99.9% (ebibanda bya solder, ebitundu ebibula)

• X-Ray (Ekifaananyi kya X-Ray).: Okufulumya <15% mu biyungo bya solder

2. Okugezesa obutonde bw’ensi

3. Okugezesa mu ngeri ya Photometric

• Okugatta Sphere: Okugumiikiriza CCT ±150K, CRI ≥80

• Enkoona y’okulaba: ≥140° horizontal/vertical, ≤50% okukka kw’okumasamasa

Okupakinga n’okutambuza ebintu

1. Okukuuma obunnyogovu

• Omutendera gwa MSL: Omutendera 3 (obulamu bwa wansi essaawa 72 @30°C/60%RH)

• Okupakinga mu ngeri enkalu: <10% RH n’ekirungo ekikala

2. Okuziyiza okukankana/okukankana

• ISTA 3A: Awona amatondo ga 1.2m, 50G impacts

3. Ebiwandiiko ebikwata ku kugoberera amateeka

• Obukuumi: UL/cUL, C. E., CCC

• Eby’obutonde bw’ensi: RoHS 2.0, REACH SVHC <0.1% .