LED Yerekana Mugukora Gukora: Inzira, Ibipimo, hamwe no kugenzura ubuziranenge

Intangiriro kuri LED Yerekana Ikoranabuhanga

IbigezwehoLED Yerekana Mugaragazashingira kuri semiconductor electroluminescence, aho InGaN / GaN chip itanga urumuri rwubururu (450nm) rwahindutse umweru ukoresheje fosifori. Hejuru-yerekana yerekanwe kugera kuri 16-biti ya graycale, 3840Hz yo kugarura ibiciro, hamwe na 5000 nits kumurika kubisabwa hanze.

Ibikoresho bito n'ibigize

1. Amashanyarazi

• Andika: InGaN chip yubururu (2835/1010 paki)

• Ibisobanuro:

• Uburebure: 450 ± 2nm

• Umuvuduko w'imbere: 2.8-3.4V @ 20mA

• Imikorere ya Luminous: ≥180 lm / W.

2. Ibikoresho bya Encapsulation

3. Substrates

• Aluminium PCB: Amashanyarazi yubushyuhe ≥2.2W / m · K, Cu ubugari bwa 35 ± 5μm

• Ceramic PCB: AlN substrates (24W / m · K) kumashanyarazi menshi ya LED

Itara LED Ibikorwa byo Gukora

1. Gupfa

• Ibifatika: Epoxy ya silver (80% Ag)

• Gukiza: 150 ℃ / 1hr, uburebure bwumurongo wa 25 ± 5μm

• Ukuri: Ikosa ryo gushyira ≤ ± 15μm

2. Guhuza insinga

• Umugozi: 99,99% Au, diameter 1.0mil

• Ibipimo: Ultrasonic power 50W, imbaraga 30g, igihe cyizuba 0.3s

3. Encapsulation

• Inzira: Kubumba Vacuum (≤1kPa, 30min degassing)

• Gukiza: 135 ℃ / 4hrs, umubyimba wa bubble ≤30μm

4. Inteko yanyuma

• Gukora pin: Gukata kogosha ± 0.1mm kwihanganira

• Binning: Uburebure bwa 2nm, ubukana bwa luminike ± 5%

SMD LED Uburyo bwo Gukora

1. Icapiro rya Solder

• Ikaramu: Icyuma gikata ibyuma bidafite ingese, uburebure bwa 0,12mm

• Umucuruzi: SAC305 ivanze, ingano 80-120 mm (SPI ikurikiranwa)

2. Gushyira Ibigize

• Imashini: Kwihuta-gutora-ahantu (30.000 CPH)

• Icyitonderwa: ± 0.03mm (X / Y), ± 0.5 ° (θ)

3. Kugaragaza Kugurisha

• Umwirondoro:

• Shyushya: 1-2 ℃ / s kugeza 150 ℃

• Impinga: 245 ℃ (60s hejuru ya 217 ℃)

• Ikirere: Azote (O₂ <1.000ppm)

4. Gushushanya no gushushanya

• Gushushanya: Kwimura inzira @ 8-12MPa, 150 ℃ / 180s

• Gukata Laser: 355nm UV laser, imbaraga 5W, umuvuduko wa 100mm / s

Mini / Micro LED Yambere Yambere

1. Ikoranabuhanga rya Transfer

• Laser Lift-Off (LLO):

• Igipimo cyo kohereza: 99,99% (R&D), 99.9% (umusaruro)

• Ukuri: ± 1.5μm gushyira

2. Chip-on-Board (COB)

• Ubucucike bwa Pixel: 100-200 PPI

• Encapsulation: Epoxy yumukara yuzuza (ΔE <1.5)

3. Ibipimo byimodoka-Urwego

• AEC-Q102: -40 ℃ kugeza 125 ℃ imikorere, 85 ℃ / 85% RH / 1.000h

• Ikizamini cyo Kunyeganyega: 50G ihungabana (MIL-STD-883 Uburyo 2002)

Sisitemu yo kugenzura ubuziranenge

1. Kugenzura-Ibikorwa

• AOI: Kugaragaza neza ≥99.9% (ibiraro byabagurisha, ibice byabuze)

• X-Ray: Gutakaza <15% mubice bigurishwa

2. Kwipimisha Ibidukikije

3. Kwipimisha Photometric

• Guhuriza hamwe: Kwihanganira CCT ± 150K, CRI ≥80

• Kureba Inguni: 40140 ° itambitse / ihagaritse, ≤50% igabanuka

Gupakira hamwe n'ibikoresho

1. Kurinda Ubushuhe

• Urwego rwa MSL: Urwego rwa 3 (72hrs ubuzima bwo hasi @ 30 ℃ / 60% RH)

• Gupakira: <10% RH hamwe na desiccant

2. Kurwanya / Kunyeganyega

• ISTA 3A: Kurokoka 1,2m ibitonyanga, ingaruka za 50G

3. Ibyangombwa byubahirizwa

• Umutekano: UL / CUL, CE, CCC

• Ibidukikije: RoHS 2.0, SHAKA SVHC <0.1%