Whakaaturanga Whakaaturanga Mata Matapihi: Nga Tukatuka, Paerewa, me te Mana Kounga

Whakataki ki te Hangarau Whakaaturanga LED

HouNga Mata Whakaaturanga LEDwhakawhirinaki ki runga i te hikohiko hikohiko, kei reira nga maramara InGaN/GaN e tuku ana i te marama kikorangi (450nm) ka huri ki te ma ma te paninga phosphor. Ko nga whakaaturanga teitei-mutunga ka eke ki te 16-bit kireira, 3840Hz reeti whakahou, me te 5,000 nits kanapa mo nga tono o waho.

Raw Materials me nga Waehanga

1. maramara arahina

• Momo: InGaN maramara kahurangi (2835/1010 pōkai)

• Whakatakotoranga:

• Te roangaru: 450±2nm

• Ngaohiko Whakamua: 2.8-3.4V @20mA

• Te Mana Maamaa: ≥180 lm/W

2. Rauemi Encapsulation

3. Raupapa

• Konumohe PCB: Kawenga wera ≥2.2W/m·K, Cu matotoru 35±5μm

• PCB uku: Nga taputapu AlN (24W/m·K) mo nga raupapa LED hiko teitei

RAMA LED Production Rerengamahi

1. Die Bonding

• Whakapiri: Hiriwa epoxy (80% Ag ihirangi)

• Te whakaora: 150 ℃ / 1hr, te matotoru raina here 25±5μm

• Tika: Hapa Whakanoho ≤±15μm

2. Waea Hononga

• Waea: 99.99% Au, diameter 1.0mil

• Tawhā: Ultrasonic mana 50W, kaha 30g, huringa wā 0.3s

3. Whakakapi

• Tukanga: Potting korehau (≤1kPa, 30min te whakaheke hau)

• Te whakaora: 135℃/4hrs, mirumiru diameter ≤30μm

4. Huihuinga Whakamutunga

• Hanga Pin: Te tapahi kutikuti ±0.1mm te manawanui

• Binning: Te roangaru ±2nm, te kaha maramara ±5%

SMD LED Manufacturing Tukanga

1. Whakapiri Whakapiri Koohiko

• Tirohanga: He kowiri tira tapahi taiaho, 0.12mm te matotoru

• Solder: SAC305 koranu, rōrahi 80-120μm (SPI aroturuki)

2. Whakaritenga Waahanga

• Miihini: Te tiki-me-wahi tere-tere (30,000 CPH)

• Tikanga: ±0.03mm (X/Y), ±0.5° (θ)

3. Reflow Soldering

• Kōtaha:

• Whakawerahia: 1-2 ℃/s ki te 150 ℃

• Te tihi: 245℃ (60s ki runga ake i te 217℃)

• Huringa: Hauota (O₂ <1,000ppm)

4. Mou me te Mataono

• Whakaneo: Te tukanga whakawhiti @8-12MPa, 150℃/180s

• Tapahi Taiaho: 355nm UV laser, 5W mana, 100mm/s tere

Nga Tukatuka Arā Mini/Miro LED

1. Hangarau Whakawhiti Papatipu

• Taiaho Hiki-Weto (LLO):

• Te utu whakawhiti: 99.99% (R&D), 99.9% (whakaputa)

• Tika: ± 1.5μm whakanohonga

2. Marama-i-papa (COB)

• Pika Kiato: 100-200 PPI

• Whakakapi: Pango epoxy whakakī (ΔE <1.5)

3. Nga Paerewa Tohu-Motu

• AEC-Q102: -40℃ ki te 125℃ mahi, 85℃/85%RH/1,000h

• Whakamatau Wiri: 50G wiri (MIL-STD-883 Tikanga 2002)

Pūnaha Mana Kounga

1. In-Tukatuka Tirotiro

• AOI: Te kitenga koha ≥99.9% (nga piriti parani, nga waahanga ngaro)

• X-Ray: Te whakakore <15% i roto i nga hononga solder

2. Te Whakamatau Taiao

3. Whakamātautau Photometric

• Te Whakakotahi i te Rohe: Whakaaetanga CCT ±150K, CRI ≥80

• Koki Tirohanga: ≥140° whakapae / poutū, ≤50% te heke kanapa

Whakapaipai me te Logistics

1. Tiaki makuku

• Taumata MSL: Taumata 3 (72 haora te ora o te papa @30℃/60%RH)

• Whakapakari maroke: <10% RH me te whakamaroke

2. Rua / Wiri Atete

• ISTA 3A: Ka ora i te 1.2m topa, 50G nga paanga

3. Tuhinga Tautukunga

• Haumaru: UL/cUL, CE, CCC

• Taiao: RoHS 2.0, REACH SVHC <0.1%