Wax-soo-saarka Shaashada LED-ka: Nidaamyada, Heerarka, iyo Xakamaynta Tayada

Hordhaca Tignoolajiyada Bandhiga LED

Casri ahShaashadaha Muujinta LEDku tiirsan semiconductor electroluminescence, halkaas oo Chips InGaN/GaN ay sii daayaan iftiinka buluuga ah (450nm) oo loo beddelay caddaan iyada oo loo marayo daahan fosfoor ah. Soo bandhigida dhamaadka-sare waxay gaadhaan 16-bit grayscale, 3840Hz heerarka soo kicinta, iyo 5,000 nits dhalaalka codsiyada dibadda.

Walxaha iyo Walxaha ceeriin

1. Chips LED

• Nooca: InGaN chips buluug (2835/1010 xirmo)

• Tilmaamaha:

• Dhererka hirarka: 450± 2nm

• Korantada hore: 2.8-3.4V @20mA

• Waxtarka Iftiinka: ≥180 lm/W

2. Qalabka koofiyadaha

3. Substrates

• Aluminium PCBDareenka kulaylka ≥2.2W/m·K, Cu dhumucda 35±5μm

• PCB dhoobada: AlN substrates (24W/m·K) oo loogu talagalay arraysyada LED-yada ee awoodda sare leh

Socodka Shaqada Wax Soo Saarka laambad LED

1. Dhimashada Bonding

• Xabag: epoxy Silver (80% Ag waxa ku jira)

• Daawaynta: 150 ℃ / 1 saac, dhumucdiisuna waxay line bond 25 ± 5μm

• SaxnaantaCilada meelaynta ≤±15μm

2. Isku xidhid silig

• Silig: 99.99% Au, dhexroor 1.0mil

• Halbeegyada: Awoodda Ultrasonic 50W, xoog 30g, wakhtiga wareegga 0.3s

3. Encapsulation

• HabkaDheriga faakuumka (≤1kPa, 30min degeyska)

• Daawaynta: 135 ℃/4saac, dhexroor xumbo ≤30μm

4. Golaha ugu dambeeya

• Samaynta Pin: Goynta xiirta ± 0.1mm dulqaad

• BinningMawjada dhererka ± 2nm, xoogga iftiinka ± 5%

Habka Wax-soo-saarka LED-ka ee SMD

1. Daabacaadda Xabagta Alxanka

• Stencil: bir aan lahayn Laser-cut, dhumucdiisuna waa 0.12mm

• Alxan: SAC305 daawaha, mugga 80-120μm (SPI la kormeeray)

2. Meelaynta qaybaha

• MashiinkaQaadista iyo goobta-xawaaraha sareeyo (30,000 CPH)

• Saxnaanta: ±0.03mm (X/Y), ±0.5° (θ)

3. Alxanka dib u qulqulaya

• Profile:

• Kuleylka hore: 1-2℃/s ilaa 150℃

• Ugu sarreeya: 245 ℃ (60s ka sarreeya 217 ℃)

• JawigaNitrojiin (O₂ <1,000ppm)

4. Dhalinta iyo Goynta

• qaabayntaHabka wareejinta @8-12MPa, 150℃/180s

• Goynta Laser-ka: 355nm UV laser, 5W awood, 100mm / s xawaaraha

Nidaamyada Hormarsan ee Mini/Mikro LED

1. Tiknoolajiyada wareejinta tirada badan

• Kor-u-qaad Laser ah (LLO):

• Qiimaha wareejinta: 99.99% (R&D), 99.9% (wax soo saar)

• Saxnimada: ± 1.5μm meelaynta

2. Chip-on-Board (COB)

• Cufnaanta Pixel: 100-200 PPI

• EncapsulationBuuxinta epoxy madow (ΔE <1.5)

3. Heerarka Darajada Gawaarida

• AEC-Q102: -40 ℃ ilaa 125 ℃ hawlgalka, 85℃/85% RH/1,000h

• Baaritaanka gariirka: 50G naxdinta (MIL-STD-883 Habka 2002)

Nidaamyada Xakamaynta Tayada

1. In-In-Process Inspection

• AOI: Ogaanshaha cillad ≥99.9% (buundooyinka alxanka, qaybaha maqan)

• X-ray: Baaba'a <15% ee kala-goysyada alxanka

2. Tijaabada Deegaanka

3. Tijaabada Sawirka Sawirka

• Isku dhafka Sphere: dulqaadka CCT ± 150K, CRI ≥80

• Xagasha Daawashada: ≥140° jiif/toos ah, ≤50% dhalaalka hoos u dhaca

Baakadaha iyo Saadka

1. Ilaalinta qoyaanka

• Heerka MSLHeerka 3 (Nolosha dabaqa 72saac @30℃/60%RH)

• Baakad qallalan: <10% RH oo leh qalajiye

2. Iska caabin Naxdin/Gariir

• ISTA 3A: Wuxuu ka badbaaday 1.2m dhibcood, 50G saameyn

3. Dukumentiyada U Hogaansanaanta

• Badbaadada: UL/cUL, CE, CCC

• Deegaanka: RoHS 2.0, GAARA SVHC <0.1%