I-LED Display Screen Manufacturing: Iinkqubo, iMigangatho, kunye noLawulo loMgangatho

Intshayelelo kwiTekhnoloji yokuBonisa i-LED

YangokuIzikrini zokubonisa i-LEDbathembele kwi-semiconductor electroluminescence, apho iitshiphusi ze-InGaN/GaN zikhupha ukukhanya okuluhlaza okwesibhakabhaka (450nm) kuguqulelwe kumhlophe ngokutyabeka kwephosphor. Iziboniso zomgangatho ophezulu zifikelela kwi-16-bit grayscale, i-3840Hz amazinga okuhlaziya, kunye ne-5,000 yee-nits zokuqaqamba kwizicelo zangaphandle.

IMathiriyeli ekrwada kunye neMicimbi

1. Ii-chips ze-LED

• UhloboIitshiphusi eziluhlaza ze-InGaN (iiphakheji ezingama-2835/1010)

• Iinkcukacha:

• Ubude bobude: 450±2nm

• Phambili Voltage: 2.8-3.4V @20mA

• Ukusebenza okukhanyayo: ≥180 lm/W

2. IiMathiriyeli ze-Ecapsulation

3. Iisubstrates

• I-Aluminiyam PCB: I-Thermal conductivity ≥2.2W/m·K, Ubukhulu be-Cu 35±5μm

• I-PCB yeCeramic: I-AlN substrates (24W/m·K) yoluhlu lwamandla aphezulu e-LED

I-LAMP LED Production Workflow

1. Die Bonding

• Ukuncamathelisa: Isiliva epoxy (80% Ag umxholo)

• Ukunyanga: 150℃/1hr, bond line ubukhulu 25±5μm

• Ukuchaneka: Impazamo yokubeka ≤±15μm

2. Ukudibanisa ucingo

• Ucingo: 99.99% Au, ububanzi 1.0mil

• Iiparamitha: Amandla e-Ultrasonic 50W, amandla 30g, ixesha lokujikeleza i-0.3s

3. Ukubethelela

• Inkqubo: Ukufunxa imbiza (≤1kPa, 30min degassing)

• Ukunyanga: 135℃/4hrs, iqamza ubukhulu ≤30μm

4. INdibano yokugqibela

• Ukuqulunqa iPin: Ukucheba ukusika ± 0.1mm ukunyamezela

• Binning: Ubude beWaveleng ± 2nm, ubukhulu obukhanyayo ± 5%

Inkqubo yokwenziwa kwe-SMD LED

1. Ushicilelo lwe-Solder Paste

• Istencil: Laser-cut steel stainless, 0.12mm ubukhulu

• Solder: SAC305 ingxubevange, umthamo 80-120μm (SPI esweni)

2. Ukubekwa kwecandelo

• Umatshini: Isantya esiphezulu sokukhetha kunye nendawo (30,000 CPH)

• Ukuchaneka: ±0.03mm (X/Y), ±0.5° (θ)

3. I-Reflow Soldering

• Inkangeleko yesimo:

• Ubushushu: 1-2℃/s ukuya kwi-150℃

• Incopho: 245℃ (60s ngaphezulu kwe217℃)

• UmoyaINitrojeni (O₂ <1,000ppm)

4. Ukubumba kunye neDicing

• Ukubumba: Inkqubo yokudlulisa @8-12MPa, 150℃/180s

• Ukusika iLaser: 355nm UV laser, 5W amandla, 100mm / s isantya

Iinkqubo ezincinci / ezincinci ze-LED

1. UbuChwephesha boTshintsho ngoBuninzi

• ILaser Lift-Off (LLO):

• Ireyithi yokutshintshela: 99.99% (R&D), 99.9% (imveliso)

• Ukuchaneka: ± 1.5μm ukubekwa

2. Itshiphu ebhodini (COB)

• Ubuninzi bePixel: 100-200 PPI

• Encapsulation: Ukuzaliswa kwe-epoxy emnyama (ΔE <1.5)

3. ImiGangatho yeBanga leMoto

• I-AEC-Q102: -40℃ ukuya 125℃ ukusebenza, 85℃/85%RH/1,000h

• Uvavanyo lokungcangcazela: Ukutshatyalaliswa kwe-50G (I-MIL-STD-883 Indlela ye-2002)

IiNkqubo zoLawulo loMgangatho

1. Ukuhlolwa kweNkqubo

• AOI: Ukubonwa kwesiphene ≥99.9% (iibhulorho ezithengiswayo, iindawo ezingekhoyo)

• I-X-Ray: Ukukhupha i-<15% kwii-solder joints

2. Uvavanyo lokusingqongileyo

3. Uvavanyo lwePhotometric

• Ukudibanisa iSphere: Ukunyamezela kweCCT ± 150K, CRI ≥80

• I-engile yokujonga: ≥140° ngokuthe tye/the nkqo, ≤50% ukuhla kokukhanya

UkuPakisha kunye noLungiselelo

1. Ukhuseleko lokufuma

• Inqanaba le-MSL: Inqanaba lesi-3 (72hrs ubomi bomgangatho @30℃/60%RH)

• Ukupakisha okomileyo: <10% RH kunye ne-desiccant

2. Ukothuka/Ukumelana nokungcangcazela

• ISTA 3A: Usinda kwi-1.2m yehla, iimpembelelo ze-50G

3. Amaxwebhu okuThobela

• Ukhuseleko: UL / CUL, CE, CCC

• Okusingqongileyo: RoHS 2.0, FIKA SVHC <0.1%